(Reuters) -Eaton will acquire Boyd Corporation’s thermal business from Goldman Sachs Asset Management for $9.5 billion, the fourth deal this year for the power management firm that’s seeking to bolster its data center segment to cater to AI demand surge.
Boyd Thermal forecast sales of $1.7 billion for 2026, a majority of which is expected to come from its liquid cooling technology used at data centers, Eaton said on Monday.
Eaton is one of the several companies benefiting from surging demand for electrical equipment used at data centers, as businesses worldwide expand their infrastructure to support artificial intelligence applications.
“Our combined expertise in both power and liquid cooling from the chip to the grid will enable customers to manage increasing power demands more effectively,” said Eaton CEO Paulo Ruiz.
The company said in August it expects data center and distributed IT equipment to account for the largest share of its sales by the end 2025, at about 17%.
Earlier this year, it bought Fibrebond Corporation, which designs and builds pre-integrated modular power enclosures used at data centers, for $1.4 billion.
It also acquired Resilient Power Systems, which makes transformers with applications in the EV and the data center industry, for an undisclosed amount.
The third company it acquired earlier this year is aerospace systems firm Ultra PCS for $1.55 billion.
Eaton said the Boyd acquisition, expected to close in the second quarter of 2026, will boost its adjusted earnings starting in the second year after the deal is completed.
Shares of Dublin-based Eaton were down 2% in premarket trading.
(Reporting by Aishwarya Jain in Bengaluru; Editing by Shinjini Ganguli)
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